Ultra Thin Multiwire Saw
Ultra Thin Multiwire Saw

Ultra Thin Multiwire Saw

STONEX HLMW-100/150 Ultra Thin Multiwire Saw uses 0.3–1.0 mm diamond wire to reduce kerf loss, improve stone utilization and produce thin natural-stone slabs.
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Ultra Thin Multiwire Saw for High-Yield Natural Stone Block Cutting | HLMW-100/150 | STONEX

 

Ultra Thin Multiwire Saw

 

The STONEX HLMW-100/150 Ultra Thin Multiwire Saw is designed for high-yield natural stone block cutting. By combining ultra-thin diamond wire, precise tension control and a moving cutting module, it helps reduce kerf loss and recover more usable stone from every block.

 

 

Why Ultra-Thin Multiwire Cutting?

 

For high-value natural stone, cutting efficiency is not only about speed. Reducing material loss can be equally important.

The HLMW-100/150 uses 0.3–1.0 mm ultra-thin diamond wire, producing a cutting groove of approximately 0.5–1.2 mm. The narrower kerf helps maximize block utilization and recover more usable material from each cut.

 

 

More Stone from Every Block

 

Every cut removes a certain amount of stone as kerf. With a narrower cutting path, the HLMW-100/150 helps retain more of the original block as usable slab material.

For high-value marble and premium natural stone, the objective is not simply to cut faster. It is to recover more valuable stone from every block.

Lower material loss can mean higher block utilization, more saleable slabs and better production economics, especially when processing expensive raw materials.

 

Block cutters comparision

 

 

From Conventional Multiwire Cutting to Ultra-Thin Multiwire Technology

 

Conventional multiwire saws already improve productivity by cutting multiple slabs simultaneously. The HLMW-100/150 takes this concept further by using ultra-thin diamond wire to reduce the material removed by each cut.

This makes the technology particularly valuable for marble, granite, quartzite, onyx and other high-value natural stones, where minimizing cutting loss can directly affect material recovery.

 

Ultra-Thin Wire Without Sacrificing Cutting Productivity

A thinner diamond wire does not necessarily mean slower production. The HLMW-100/150 can achieve approximately 200–300 mm/h cutting depth, comparable to conventional gang saws and multiwire saws under suitable conditions.

The key advantage is therefore not simply cutting thinner. It is maintaining competitive cutting productivity while significantly reducing kerf loss.

 

Servo-Controlled Wire Tension

 

 

Servo-Controlled Wire Tension

 

Ultra-thin diamond wire requires more precise tension management than conventional wire cutting. The HLMW-100/150 uses a patented servo-controlled wire tension system to maintain the appropriate tension during high-speed cutting and automatically respond to changes in cutting conditions.

With a wire speed of approximately 20–30 m/s, the system precisely manages wire tension t to support smooth, accurate and reliable cutting.

 

Key Advantages

  • Stable wire tension - maintains consistent cutting conditions.
  • High-speed operation - supports efficient cutting at 20–30 m/s.
  • Reduced wire vibration - helps improve cutting stability and accuracy.
  • Consistent slab quality - supports better slab flatness and surface finish.
  • Improved wire life - helps reduce unnecessary stress and wear on the diamond wire.

 

 

Low-Vibration Cutting for Fragile and Crack-Prone Stone

 

Some stone materials have a loose structure, are prone to delamination or breakage, or contain brittle areas and numerous dark cracks. These conditions can make cutting with conventional gang saws or traditional multiwire saws particularly challenging.

The HLMW-100/150 uses ultra-thin diamond wire and a low-vibration cutting process to handle such difficult materials more gently. This helps reduce cutting stress and supports more stable processing, fewer breakages and better recovery of usable stone.

 

Additional Benefits

  • Gentler processing - reduces stress on fragile and crack-prone materials.
  • Lower risk of breakage - helps protect valuable stone during cutting.
  • Improved material recovery - supports better utilization of difficult blocks.

 

Fixed Block Cutting

 

 

HLMW-100/150: Fixed Block, Moving Cutting Module

 

The HLMW-100/150 uses a two-column structure in which the stone block remains fixed while the diamond-wire cutting module moves downward.

This configuration provides a stable cutting arrangement for large stone blocks while allowing the machine to perform multiple simultaneous cuts.

Maximum block size: approximately 3600 × 2000 × 2100 mm

 

More Stone from Every Block

 

 

High Material Utilization for Block-to-Slab Production

 

The ultra-thin multiwire concept is particularly valuable when a block requires a large number of parallel cuts.

The combination of ultra-thin wire and controlled cutting makes the HLMW-100/150 suitable for factories focused on higher material utilization and lower cutting waste.

STONEX application data indicates a yield rate of over 97% under specified conditions. Actual results depend on the stone type, block dimensions, wire specification, slab thickness and cutting conditions.

 

 

Thin-Sheet Cutting: A Capability, Not the Only Application

 

One advantage of ultra-thin diamond wire is its ability to produce very thin stone sheets.

The HLMW-100/150 can support thin and ultra-thin stone cutting, with slab thickness determined by the material, wire and process configuration.

However, extremely thin large-format natural-stone sheets may not have sufficient mechanical strength for direct handling and further processing.

For applications requiring lightweight stone panels, a practical process can be:

Ultra Thin Multiwire Saw
→ 8–10 mm or approximately 6 mm stone sheet
→ Aluminum honeycomb composite
→ Ultra-Thin Single Diamond Wire Saw splitting (Optional by STONEX HLSW-100)

This approach combines the material-saving advantage of ultra-thin multiwire cutting with reinforcement for downstream handling and processing.

It opens possibilities for lightweight architectural and decorative stone products without treating an unsupported ultra-thin sheet as the finished product.

 

Cut Fragile Marble by super-fine multiwire saw

 

 

Applications of Ultra Thin Multiwire Technology

 

The HLMW-100/150 is suitable for:

• Marble block-to-slab production
• Granite and quartzite processing
• Onyx and other premium natural stones
• High-value blocks where material utilization is critical
• Thin and ultra-thin stone sheet production
• Lightweight stone panel production
• Difficult or crack-prone stone blocks
• Stone factories upgrading from conventional multiwire technology

 

Luxury stone cutting by multiwire saws

 

 

Technical Overview

 

Item

HLMW-100/150

Machine type

Ultra Thin Multiwire Saw

Structure

Two-column

Diamond wire diameter

0.3–1.0 mm

Typical cutting groove

Approx. 0.5–1.2 mm

Max. block size

Approx. 3600 × 2000 × 2100 mm

Wire speed

Approx. 20–30 m/s

Wire tension

Servo-controlled

Main motor

60 kW

Max. cutting length

3600 mm

Max. cutting height

2100 mm

 

super thin multi wire saw cases

 

 

Why Choose an Ultra Thin Multiwire Saw?

 

The HLMW-100/150 combines several technologies that work together to improve block-to-slab cutting:

Ultra-thin diamond wire → lower kerf loss
Servo-controlled tension → precise wire management
Low-vibration cutting → gentler processing of difficult stone
Moving cutting module → efficient multiwire production

For manufacturers processing valuable natural stone, the focus is straightforward: reduce unnecessary material loss and recover more usable stone from every block.

 

 

Is HLMW-100/150 Right for Your Factory?

 

The HLMW-100/150 is worth considering if your factory:
• Processes high-value natural stone blocks
• Wants to improve block utilization
• Needs to reduce kerf loss
• Requires stable multiwire cutting
• Processes fragile, cracked or difficult stone
• Is considering an upgrade from conventional multiwire technology
• Needs the flexibility to produce thin or ultra-thin stone sheets

 

Ultra thin multiwire saw factory

 

 

FAQs

 

Q: What is an Ultra Thin Multiwire Saw?

A: An Ultra Thin Multiwire Saw is a multiwire stone-cutting machine that uses ultra-thin diamond wire to reduce kerf loss and improve material utilization during block-to-slab cutting.

Q: What wire diameter does the HLMW-100/150 use?

A: The machine supports ultra-thin diamond wire in the 0.3–1.0 mm range, depending on the application and configuration.

Q: What is the cutting groove?

A: The typical cutting groove is approximately 0.5–0.7 mm, depending on the wire and cutting conditions.

Q: What stones can the HLMW-100/150 cut?

A: It can be used for marble, granite, quartzite, onyx and other natural stones, subject to the specific material and cutting conditions.

Q: Can it cut fragile or crack-prone stone?

A: Yes. Its low-vibration cutting process can help reduce cutting stress when processing stone with loose structures, internal cracks or a tendency to break.

Q: Can it produce ultra-thin slabs?

A: Yes. The HLMW-100/150 is capable of thin and ultra-thin stone cutting. The practical minimum thickness depends on the stone, wire, block size and production conditions.

Q: What is the main advantage over conventional multiwire cutting?

A: The key advantage is lower kerf loss, which can improve material utilization and increase the amount of usable stone recovered from each block.

Q: What is an Ultra Thin Multiwire Saw?

A: An Ultra Thin Multiwire Saw is a block-cutting machine that uses multiple ultra-thin diamond wires to cut a stone block into multiple slabs while minimizing cutting kerf and material loss.

Q: What is the difference between an ultra-thin multiwire saw and a conventional multiwire saw?

A: The main difference is the diameter of the diamond wire. Conventional multiwire saws typically use substantially thicker diamond wires, while the HLMW-100/150 uses approximately 0.3–1.0 mm ultra-thin diamond wire.

Q: How much material can an Ultra Thin Multiwire Saw save?

A: The potential saving depends on the stone, block size, number of cuts, wire diameter and operating conditions. The narrower cutting groove can substantially reduce kerf loss compared with conventional cutting technologies.

Q: Can HLMW-100/150 cut marble and granite?

A: Yes. The machine is designed for natural-stone block cutting and can be applied to marble, granite and other suitable stones.

Q: Can HLMW-100/150 cut 6 mm or thinner stone?

A: The machine can cut very thin stone sheets. However, large-format sheets below approximately 8 mm may have limited handling strength. For practical applications, 8–10 mm or approximately 6 mm sheets can be combined with aluminum honeycomb or another backing structure where appropriate.

Q: What is the difference between HLMW-100/150 and HLBMW-100/150?

A: HLMW-100/150 is a two-column machine with a fixed stone block and moving cutting module. HLBMW-100/150 is a four-column machine with a fixed cutting module and lifting stone block.

Q: Is an Ultra Thin Multiwire Saw suitable for replacing a gang saw?

A: It can be an alternative for certain block-to-slab applications, particularly when lower kerf loss and higher material utilization are important. The best choice depends on the stone, block dimensions, target slab thickness, production volume and overall factory workflow.

 

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