HLPM-10 Multi-Head Arc Slab Polishing Machine

The STONEX HLPM-10 Multi-Head Arc Slab Polishing Machine is designed for grinding and polishing curved stone slabs used in hollow column production and architectural stone applications. Equipped with 10 grinding heads for progressive processing from rough grinding to fine polishing, it delivers efficient, consistent surface finishing.
Key Features
Multi-Head Grinding and Polishing
Multiple grinding heads are arranged in a row on a movable module that travels along a horizontal beam with linear guide rails. The heads engage the stone surface sequentially, supporting multi-stage grinding and polishing for a smooth, uniform finish.
Vacuum Fixation and Rotary Processing
Vacuum suction cups secure the curved slab while the workpiece swings around a central axis. Meanwhile, the grinding head module moves horizontally along the beam to process the curved surface systematically.

PLC Control
The PLC control system coordinates machine movements and the processing sequence, simplifying operation and supporting consistent polishing results.
HLPM-10 vs. HLPM-12
The HLPM series is available with 10 or 12 grinding heads. Both models process stone workpieces with diameters of 350–2,000 mm and lengths up to 1,500 mm.
The HLPM-10 is suitable for standard polishing requirements, while the HLPM-12 offers greater polishing capacity and the potential for better surface finishes, depending on the stone material and processing conditions.
Since curved slabs are processed individually rather than continuously conveyed through a polishing line, the difference in overall production efficiency is generally limited. The main advantage of the HLPM-12 is its enhanced polishing capability.

Technical Specifications
|
Parameter |
HLPM-10 |
HLPM-12 |
|
Grinding heads |
10 |
12 |
|
Processable diameter |
350–2,000 mm |
350–2,000 mm |
|
Processable length |
1,500 mm |
1,500 mm |
|
Gross power |
27.5 kW |
32 kW |
|
Listed efficiency |
6 m²/min* |
6 m²/min* |
|
Water consumption |
6 m³/h |
7 m³/h |
|
Dimensions (L × W × H) |
5,200 × 1,700 × 2,900 mm |
5,800 × 1,700 × 2,900 mm |
|
Gross weight |
5,000 kg |
5,500 kg |
Please verify the listed efficiency unit before publication.

Frequently Asked Questions
Q: What is an arc slab polishing machine used for?
A: It grinds and polishes curved stone slabs used in hollow columns and other architectural stone components, from rough grinding to fine polishing.
Q: What is the difference between the HLPM-10 and HLPM-12?
A: The HLPM-10 has 10 grinding heads, while the HLPM-12 has 12. Both offer the same workpiece dimensions, but the HLPM-12 provides greater polishing capacity and can achieve better finishing results under suitable processing conditions.
Q: What is the maximum workpiece size?
A: Both models process stone workpieces with diameters of 350–2,000 mm and lengths up to 1,500 mm.
Q: How does the machine polish curved stone slabs?
A: Vacuum suction cups hold the slab as it swings around a central axis. The grinding head module travels horizontally, and the heads engage the curved surface sequentially for multi-stage polishing.
Q: Does the machine use PLC control?
A: Yes. PLC control coordinates machine movements and the processing sequence, simplifying operation and supporting consistent results.
Q: Does the HLPM-12 significantly increase production speed?
A: Not necessarily. The additional grinding heads mainly improve polishing capability and finishing performance. Overall throughput depends on the stone material, required finish, and processing parameters.
Q: How do I choose the right model?
A: Choose the HLPM-10 for standard polishing requirements or the HLPM-12 when enhanced polishing capability is a priority. Consider your stone material, workpiece dimensions, and desired surface finish when selecting a model.
Find the Right Solution for Your Stone Processing Needs
Contact STONEX to discuss your curved slab dimensions, stone material, and finishing requirements. Our team can help you select a suitable arc slab polishing machine for your hollow column production.
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